More Than Silicon® - Technical Seminar

ams' More Than Silicon® initiative is a comprehensive service and technology package that goes beyond industry standard foundry services. Foundry customers instantly benefit from access to leading edge technology add-ons, advanced packaging services and dedicated support engineers to enable first-time-right designs.

It is ams' "Full Service Foundry" philosophy to closely cooperate with its customers and to provide optimal solutions and extended design support services for challenging analog/mixed-signal applications. As part of this foundry initiative ams and Fraunhofer IIS are pleased to announce a complimentary half day technical seminar in Erlangen, Germany with the following agenda:

12:30 - 13:00 Registration
13:00 - 13:15 Welcome and introduction
13:15 - 14:00 0.18µm High-Voltage Technology Overview
14:00 - 14:30 High-Voltage Design Flow
14:30 - 15:00 Coffee break
15:00 - 15:15 System-on-Chip (SoC) design
15:15 - 15:30 ams' More Than Silicon initiative - Overview
15:30 - 16:15 More Than Silicon: CMOS Opto Process add-ons
16:15 - 16:45 More Than Silicon: 3DIC using TSV's
16:45 - 17:15 Q&A
Date: Monday, March 31, 2014
Venue: Fraunhofer IIS
Am Wolfsmantel 33
91058 Erlangen, Germany

Note: Seating for this seminar is limited! For reservation or further information please send an email to or

Short Description of the Seminar

H18 process
The ams H18 process is the next generation of high-performance analog and mixed-signal technologies, ideally suited for a wide variety of applications such as power management, motor control, printer head drivers, DC/DC converters, switched power supplies, LCD drivers and backlight controllers. Offering a comprehensive portfolio of 20V and 50V devices across a choice of 3 gate oxide options and extending the 0.18µm CMOS technology by only three masks, the H18 process enables integration of even more digital logic and is therefore the perfect solution for SOC Designs.

High-Voltage Design Flow for Integrated 3DIC System
The ams High-Voltage design flow enables designer to create a 3D integrated Silicon Sensor System based on standard CMOS processes using existing CAD software. It ensures that both the active circuit die as well as the sensor die work independently and are connected correctly. Ideally the entire stack (two different dies in a 3D stacks) should be simulated together and of course physical verification should ensure that both wafers are connected correctly.

More Than Silicon®
ams More Than Silicon® initiative is a comprehensive service and technology package that goes beyond industry standard foundry services.

Through Silicon Via technology
ams patented Through Silicon Via technology (TSV) enables the smallest form factors and addresses a variety of markets demanding 3D integration of CMOS ICs, photo sensors, gas sensors, power devices or MEMS components required in automotive, industrial & consumer applications where two eight inch wafers can be electrically interconnected in its most efficient way. Foundry customers using the ams TSV concept immediately benefit from a significantly reduced form factor, systems cost reduction and utmost flexibility in IC and sensor arrangement.